Hong Kong | Industry Insight
SHINDEV’s latest deep research indicates that advanced upgrading across PCB and the broader pan-semiconductor ecosystem is accelerating a new round of lithography technology replacement. As the industry moves toward higher density, finer lines, smaller vias, higher integration, and greater reliability, Direct Imaging (DI) and Maskless Direct-Write Lithography (MDWL) are demonstrating clear advantages over traditional exposure and mask-based lithography in flexibility, iteration speed, cost structure, and multi-product, small-batch manufacturing.
SHINDEV believes the core value proposition of direct-write lies in its maskless workflow: manufacturers can iterate processes and product designs rapidly, switch production schemes with higher agility, and shorten cycle times—making it highly compatible with fast-evolving segments such as advanced packaging, panel-level packaging, high-end PCB, Mini/Micro-LED, new materials, and flexible electronics. With PCB capacity shifting toward China, downstream demand upgrading, and accelerating localization of high-end equipment, domestic suppliers are entering a critical window for import substitution in direct-write and DI tools.
Lithography is a cornerstone process in semiconductor and micro-nano manufacturing. It transfers patterns from a photomask to a wafer or substrate via photoresist under exposure. Over the past six decades, the dramatic shrink of feature sizes and the rise in integration have been inseparable from lithography advances. Today, amid chip supply constraints, manufacturing upgrades, and diversified end-market demand, the industry is shifting from single-metric competition to a multi-objective optimization across precision × throughput × cost × flexibility.
In the pan-semiconductor domain, lithography can be classified into mask-based and maskless direct-write methods. Direct-write lithography uses computer-controlled high-precision beams (optical or charged particles) to scan and expose photo-sensitive materials directly—eliminating mask fabrication, lead time, and iteration costs.
By radiation source, direct-write can be broadly grouped into:
Charged-Particle Maskless Lithography (CPML): e-beam, ion-beam, etc.
Optical Maskless Lithography (OML): interference, laser direct-write, and spatial light modulator (SLM/DMD)-based approaches.
Among these, DMD (Digital Mirror Device) arrays driven by FPGA to form patterns and projected through optical objectives—often referred to as DLP-type digital optical processing—are gaining traction due to fast pattern generation and flexible iteration.
Traditionally, mask-based lithography dominates high-precision IC front-end manufacturing, while direct-write has been used for mask making and selected IC production needs. However, in scenarios where flexibility is critical—advanced packaging, high-end PCB, display and emerging materials—direct-write increasingly becomes the preferred option.
Key advantages include:
Shorter iteration cycles enabled by maskless switching;
Multi-layer alignment and compensation for advanced processes;
High-mix/low-volume production and “one-panel-one-code” smart manufacturing;
Curved-surface exposure and special substrate adaptability for new materials.
SHINDEV observes that direct-write has already become mainstream in panel-level packaging and high-end PCB, and is showing a clear substitution trend in high-end display, advanced packaging, flexible electronics, and third-generation semiconductors.
In large-scale PCB manufacturing, exposure solutions can be categorized into traditional film-based exposure and Direct Imaging (DI). Compared with traditional exposure, DI delivers superior overall performance across precision, alignment, yield, environmental compliance, cycle time, cost, flexibility, and automation.
As downstream electronics move toward portability, thinness, and high performance, PCB products continue upgrading toward finer lines and higher density. DI systems have already achieved minimum line widths around 5 μm in industrial production, making DI a mainstream solution for mid-to-high-end PCB fabrication. SHINDEV expects DI penetration to keep rising as PCB upgrading drives equipment replacement cycles.
SHINDEV’s research highlights multiple growth engines for direct-write lithography:
New display (Mini/Micro-LED): capacity expansion and process upgrades drive equipment demand;
Leadframes: ultra-thin and high-integration trends raise precision and flexibility needs, accelerating substitution;
Advanced packaging: post-Moore era boosts adoption where alignment flexibility, large-area packaging, and automatic coding are required;
FPD: while high-gen mass production still relies on projection lithography, mask capacity limits and high mask costs create openings in R&D and small-batch production;
Flexible electronics: traditional mask-based lithography faces limitations on polymer substrates and solvent compatibility—direct-write offers superior adaptability for complex micro-features and 3D circuit shapes.
SHINDEV notes that global PCB manufacturing continues shifting toward Mainland China, where market share is steadily increasing. Yet direct-write/DI equipment remains dominated by leading overseas suppliers, and certain high-end manufacturing processes still rely on imported tools due to late domestic entry and high technical barriers.
However, supported by industrial policies, cost sensitivity in PCB manufacturing, improving local supply chains, and localized delivery/service advantages, domestic suppliers may progressively achieve import substitution via performance upgrades, cost effectiveness, and faster on-site support, while exploring export opportunities in selected segments.
SHINDEV believes there is no universally perfect lithography technology—industry players continuously balance cost, throughput, precision, and manufacturability to find dynamic optimums. Direct-write has already secured mainstream adoption in panel-level packaging and high-end PCB, and is increasingly positioned to substitute mask-based lithography in high-end display, advanced packaging, flexible electronics, and third-generation semiconductors. With global PCB manufacturing further concentrating in China and direct-write technology maturing industrially, upstream domestic equipment suppliers are poised to capture meaningful market opportunities.
